Precision Solutions is a global supplier of tooling and componentry for the semiconductor industry. We have over five decades of history of being a major semiconductor manufacturer, specifically supplying the leading semiconductor organizations with wire bonded chips and guides. Our precision machinists manufacturer wire bonded chips and guides and semiconductor parts and components used throughout the chip and technology and semiconductor industries. High finishes (mirror finishes), material selection and flatness are of prime importance for manufacturing the finished product.
Jewel clamps, connectors, gluing and injection nozzles, punches, wire bonded guides and tooling and other components are a few of the parts manufactured for the chip and semiconductor industry. Most parts and components are made from carbide, but other materials include hardened steels. Precision Solutions has the capability to achieve a .4RA (.01016 micron) finish or better if needed. By conducting a series of proprietary precision lapping services, Precision Solutions machinists are able to meet customer expectations regarding surface finish and flatness. We also have the ability to machine hole sizes to .001″ (.00003937mm).
Wire bonding involves creating electrical interconnections between an integrated circuit (or other semiconductor device) and silicon chips using bonding wires. Bonding wires are fine wires made from gold and aluminum. The two most common types of wire bonding are ball bonding and aluminum wedge bonding.
Gold wire bonding is achieved through thermosonic bonding. In thermosonic bonding, each end of the wire is melted to form a gold ball, which is the air-free ball. The diameter of the air-free ball is 1.5-2.5 times bigger than the diameter of the wire. Aluminum wedge bonding uses pressure and ultrasonic energy to form the wire bonds. When gold wire is used, temperatures reach 150 degrees Celsius and the process is very similar to gold wire bonding and called thermosonic bonding. Low temperatures are more commonly used when aluminum wedge bonding.